Reball

IC Chip Packaging can restore your BGA with NEW solder balls!

Our process includes:

1. Remove moisture by baking the devices at 100C for 24 hours
2. Remove old solder balls and apply new solder balls
3. Reflow devices with new solder balls through Electrovert OmniFlo 7 (Lead Free Capability)
4. Clean devices with DI water
5. Inspect under optical microscope and take pictures of the reballed devices prior to delivering them to our customers

We stock Lead Free (Pb-Free) and PbSn (eutectic) solder balls in the following sizes:

• 0.012" (Typical for 0.5 mm pitch BGA)
• 0.015" (Typical for 0.65 mm pitch BGA)
• 0.020" (Typical for 0.8 mm pitch BGA)
• 0.025" (Typical for 1.0 mm picth BGA)
• 0.030" (Typical for 1.27 mm and higher pitch BGA)
• Other Custom sizes and Alloys can be ordered to meet your needs.