Open Cavity Packaging Assembly

Re-Encapsulation (Open Cavity Packaging Assembly) method allows IC product team to place a new die in an existing IC. Since the scoop and goop devices are identical to the production part, mechanically and electrically, this method allows product groups to reuse existing test sockets/hardware. In addition, prior to final encapsulation, the open cavity devices allows device characterization such as microprobing or device modifications such as FIB.