Real
Time X-Ray FeinFocus FXS160.62
The FXS-160.62 is a universal system for component
and material analysis. Some of its applications include
the analysis of faulty eutectic die bonding, wire bonding
flaws, wire sagging, through-hole plating integrity, and
solder joint inspections. Since our FXS160.62 has very high
X-ray Energy (up to 160KV) and a very large X-ray chamber,
it can be also used for X-ray inspection of large circuit
boards.
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