Sonix Scanning Acoustic Microscopy is a non-destructive
package analysis technique. This technique is mainly used
to determine delaminations and voids at the die surface
(C-SAM and TAMI) as well as the die and thermal pad interfaces
(Thru-SAM). For further information, please click the following
Sonix training
document.
System
Capabilities and Specifications
•
C-SAM, TAMI, and Through SAM analysis capabilities.
•
15MHz, 75MHz, and 110MHz Transducer
•
5 um resolution in horizontal directions.
