Wire Bonding Prototype Assembly

IC Chip Packaging has full capabilities to meet your wire bonding prototype assembly requirements. We have been able to demonstrate the following bonding prototype assembly requirements:

• 45um Bond Pad Pitch
• At least 5 layers bonding sweep
• More 600 of bond wires in a single BGA package.
• Scoop and Goop device on an Open Cavity Plastic Package and remolded to JEDEC standards.
• Die Attach – Epoxy or Eutectic
• Wedge & Ball Bonding – Aluminum or Gold
• Glob Top Dispensing
• Stud Bumping – Individual die
• Heavy Wire