Our Capabilities

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Wire Bonding Prototype Assembly

IC Repackaging For Failure Analysis and Device Characterization

Open Cavity Packaging Assembly (Bond and Re-encapsulated)

BGA Reball

SMT Repair and Rework

Cross-sectional Analysis

Backside Sample Preparation

Real Time X-ray Analysis

IC Decapsulation

Testing and Curve Tracing

Wafer Dicing

Scanning Acoustic Microscopy (SAM) Analysis

Scanning Electron Microscopy (SEM) Analysis

 

IC Chip Packaging
13490 TI Blvd #100
Dallas, TX 75243
Phone: (972) 470-9290
Fax: (972) 470-1688
Email: contacts@icchippackaging.com